Die Bonding in an Optoelectronic World

Moore, Don
October 2001
Circuits Assembly;Oct2001, Vol. 12 Issue 10, p40
Trade Publication
Reports the venture of printed circuit board assemblers in optoelectronics market. Familiarity on the wide variety of substrates; Description of photonic circuit; Aspects of edge-emitting laser diodes and vertical-cavity surface-emitting laser diodes.


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