TITLE

Be Gentle and Persistent in All Things

AUTHOR(S)
Hymes, Les
PUB. DATE
October 2001
SOURCE
Circuits Assembly;Oct2001, Vol. 12 Issue 10, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Responds to queries on the common problems in the assembly process and equipment selection. Approach to removing solder paste from misprinted boards; Application of water with some additive using bristle brush to dislodge the particles from the board; Proposition of various techniques by depaneling systems to successfully depanel assembled boards.
ACCESSION #
5876550

 

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