Be Gentle and Persistent in All Things

Hymes, Les
October 2001
Circuits Assembly;Oct2001, Vol. 12 Issue 10, p20
Trade Publication
Responds to queries on the common problems in the assembly process and equipment selection. Approach to removing solder paste from misprinted boards; Application of water with some additive using bristle brush to dislodge the particles from the board; Proposition of various techniques by depaneling systems to successfully depanel assembled boards.


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