TITLE

MEMS Reliability and Testing

AUTHOR(S)
Keener, Melissa; Caswell, Greg; Schueller, Randy
PUB. DATE
May 2010
SOURCE
Advancing Microelectronics;May2010, Vol. 37 Issue 3, p14
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
There are several factors that influence the reliability of MEMS devices. The types of materials used and the shape of the device affect the probability and type of failure. The three types of failure mechanisms that can be encountered are: packaging defects, packaging interfering with the device, and device defects. Cracks in the package can allow moisture in which will contaminate the MEMS device. The gap between the package and the device could collapse, interfering with the function of the device. Finally, the device can have flaws that lead to residual stress build up, eventually causing bowing and shorting. One of the issues with testing the reliability of MEMS devices is that there are few standardized tests since most are application specific. A software tool called CARAMEL was developed to model the effects of contamination to the device. Also, shock tests have been run that demonstrate that the shape of the microsystem affects the intensity of stresswaves.
ACCESSION #
58622833

 

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