MEMS Reliability and Testing

Keener, Melissa; Caswell, Greg; Schueller, Randy
May 2010
Advancing Microelectronics;May2010, Vol. 37 Issue 3, p14
Trade Publication
There are several factors that influence the reliability of MEMS devices. The types of materials used and the shape of the device affect the probability and type of failure. The three types of failure mechanisms that can be encountered are: packaging defects, packaging interfering with the device, and device defects. Cracks in the package can allow moisture in which will contaminate the MEMS device. The gap between the package and the device could collapse, interfering with the function of the device. Finally, the device can have flaws that lead to residual stress build up, eventually causing bowing and shorting. One of the issues with testing the reliability of MEMS devices is that there are few standardized tests since most are application specific. A software tool called CARAMEL was developed to model the effects of contamination to the device. Also, shock tests have been run that demonstrate that the shape of the microsystem affects the intensity of stresswaves.


Related Articles

  • Initial inertial gestures. Israelsohn, Joshua // EDN;2/2/2006, Vol. 51 Issue 3, p32 

    The article discusses developments in the field of microelectro-mechanical-systems (MEMS) inertial sensors. The various packaging innovations for MEMS devices have given rise to new applications for inertial sensors. They also created the MEMS inertial sensors market. Compared to...

  • MEMS In the Making. Migliore, Matt // Flow Control;Nov2011, Vol. 17 Issue 11, p6 

    The article presents detailed information on the MicroElectroMechanical System (MEMS). MEMS refers to a device possessing small form factor, mechanical operating principle, and electric-based power source. It is stated that as new packaging methods are becoming available for enabling a higher...

  • UBM: Creating the Critical Interface. O'Donnell, Kathy // Advanced Packaging;Apr2008, Vol. 17 Issue 3, p44 

    The author reflects on the various used of bumping technologies under the bump metallization (UBM). He refers to the used of those technologies under UBM to meet the package reliability requirements. He discusses on UBM which provides a critical interface between the metal pad and the solder...

  • THE INFLUENCE OF THE PACKAGE ENVIRONMENT ON THE FUNCTIONING AND RELIABILITY OF CAPACITIVE RF-MEMS SWITCHES. De Wolf, Ingrid; Czarnecki, Piotr; Jourdain, Anne; Modlinski, Robert; Tilmans, Harrie A. C.; Puers, Robert; Van Beek, Joost T. M.; Van Spengen, W. Merlijn // Microwave Journal;Dec2005, Vol. 48 Issue 12, p102 

    This article discusses the influence of the packaging process and environment on the functioning and reliability of capacitive RF-microelectromechanical systems (MEMS). It is shown that the packaging temperature profile can change the mechanical stress in the suspended metal bridge of the MEMS....

  • The package. Levine, Bernard // Electronic News;4/17/95, Vol. 41 Issue 2061, p60 

    Reports on developments concerning electronic packaging in the United States, for the week ended April 17, 1995. Includes a preview on the 4th International Conference & Exhibition on Multichip Modules; Quality Semiconductor Inc.'s decision to reduce prices for its QVSOP package; Debut of...

  • The package. Levine, Bernard; Guinther, Fred // Electronic News;1/15/96, Vol. 42 Issue 2099, p36 

    Offers brief reports relating to packaging in the electronics industry as of January 15, 1996. Effect of the semiconductor boom of 1995; Contract manufacturer Flextronics International Ltd. to acquire Hong Kong-based Astron Group, Ltd.; A major order awarded by ASAT to Sheldahl, Inc.; Other briefs.

  • The package. Levine, Bernard,; Guinther, Fred, // Electronic News;12/01/97, Vol. 43 Issue 2196, p66 

    Reports on developments in the microelectronic packaging industry as of December 1, 1997. Introduction of ProLinx Labs' copper-core ball grid array; Licensing of an advanced patent-pending process claimed to eliminate voids; Sheldahl's plan to open an office in Hong Kong during the first...

  • Development of MEMS Power Sensor Package. Kim, Bruce C.; Kasim, Rahim // Journal of Microelectronic & Electronic Packaging;2010 3rd Quarter, Vol. 7 Issue 3, p169 

    This article presents the design, fabrication, and packaging of advanced MEMS in high power applications. The advanced MEMS devices are used as a power sensor to detect high current in a distributed power network. We designed and fabricated an M× N array of low power MEMS switches to handle...

  • MEPTEC'S ANNUAL MEMS PACKAGING SYMPOSIUM EXAMINES MARKET GROWTH. Goldstein, Julia // Advanced Packaging;Jul2006, Vol. 15 Issue 6, p10 

    Information about several papers discussed at the 4th Annual Microelectronics Packaging and Test Engineering Council symposium of Micro-Electronic-Mechanical Systems (MEMS) packaging on May 17-18, 2006 in San Francisco,California is presented. Market analyst, Mathieu Potin presented an analysis...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics