TITLE

White Residue: Good or Bad?

AUTHOR(S)
Munson, Terry
PUB. DATE
September 2001
SOURCE
Circuits Assembly;Sep2001, Vol. 12 Issue 9, p68
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Examines the implications of process residues on surface boards during micro ball grid analysis. Types of cleaning protocols used in the boards; Exposure of risks for leakage and electromigration problems using solder paste; Consequences of flux residues.
ACCESSION #
5860801

 

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