White Residue: Good or Bad?
- Broken Balls. HUNT, CHRIS // Printed Circuit Design & Fab: Circuits Assembly;Jan2013, Vol. 30 Issue 1, p42
The article describes how excessive testing force can damage the ball grid array (BGA) connection.
- 3-D Measurement System for Use in Microelectronics. Lee, Mikyoung; Pecht, Michael; Tyson, John; Schmidt, Timothy // Advanced Packaging;Nov2003, Vol. 12 Issue 11, p33
Features a cost-effective, three-dimensional system that measures warpage in electronic devices. Background on ball grid array package warpage caused by the mismatch of coefficients of thermal expansion and asymmetric package geometry; Solder joint reliability problems created by ball grid...
- BGA Reballing Reliability. Cirimele, Ray // Circuits Assembly;Jun2009, Vol. 20 Issue 6, p27
The article presents a study on multiple ball grid array (BGA) reball processes which looks at copper dissolution and functionality. During the ball removal process, ten samples were prepared for copper dissolution evaluation. The manual method for solder ball removal process resulted in the BGA...
- BGA connectors offer benefits in midplane and backplane applications. Emenheiser, Matthew // Connector Specifier;May2003, Vol. 19 Issue 5, p16
Discusses the advantages of ball-grid-array (BGA) connectors over standard press-fit connections in midplane and backplane applications. Hurdle facing the introduction of BGA connectors; Overview of an experiment designed to evaluate BGA connector processing.
- Hybrid Reflow Profiles. Rowland, Robert // SMT: Surface Mount Technology;Aug2005, Vol. 19 Issue 8, p14
Discusses the usability of lead-free components with SnPb solder. Dependence of ball grid array technology on peak temperature and dwell time; Inclusion of lead in tin whisker-pin-connector systems.
- Focus on Lead-free Defects in the IPC-7095 Revision. Prasad, Ray P. // SMT: Surface Mount Technology;Aug2005, Vol. 19 Issue 8, p16
Discusses the usability of the designing ball grid array technology in non-solder-mask or copper defined. Identification of the leading surface finishes for lead-free attachment; Determination of data collection and rigorous analysis; Requirement of adhesion from the solder mask.
- Vias in BGA Pads. BENSON, DUANE // Printed Circuit Design & Fab: Circuits Assembly;Dec2012, Vol. 29 Issue 12, p17
The author explains why it is not right to put open vias in ball grid array (BGA) pads. He argues against putting an exposed via in a BGA pad and instead suggests putting it between the pads, with a complete solder mask dam between the pad and via. He points out to allow nothing but metal on the...
- Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints. Tae-Kyu Lee; Kuo-Chuan Liu; Bieler, Thomas R. // Journal of Electronic Materials;Dec2009, Vol. 38 Issue 12, p2685
The microstructure evolution of Sn-Ag-Cu solder joints during aging and thermal cycling is studied, with a focus on the Sn grain orientation in plastic ball grid array (PBGA) packages. Thermally cycled PBGA packages with a full array of 196 solder joints were examined after being subjected to...
- Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads. Hsiu-Jen Lin; Tung-Han Chuang // Journal of Electronic Materials;Jan2006, Vol. 35 Issue 1, p154
During the reflowing of Sn-9Zn solder ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the surface-finished Au and Ag film dissolved rapidly and reacted with the Sn-9Zn solder to form a Î³3-AuZn4/Î³-Au7Zn18 intermetallic double layer and Îµ-AgZn6 intermetallic scallops,...