TITLE

New Developments in Flip Chip

PUB. DATE
September 2001
SOURCE
Circuits Assembly;Sep2001, Vol. 12 Issue 9, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Investigates developments in flip chip integrated circuit technology by TechSearch International Inc. in Austin, Texas. Areas of expansion of the flip chip; Introduction of wafer-level packages; Advantages of wafer bumping in the manufacturing process.
ACCESSION #
5860742

 

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