TITLE

Manncorp Turnkey Solution is Key

PUB. DATE
September 2010
SOURCE
SMT: Surface Mount Technology;Sep2010, Vol. 25 Issue 5, p58
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article offers information on Sensaphone Inc. which is a leading manufacturer of remote electronic sensors. As stated, Sensaphone was founded by Kenneth E. Blanchard 25 years ago and now has brought its own surface mount technology (SMT) assembly of remote monitoring systems in house with the help of Mancorp's Turkey Solution. Sexaphone's line of products include, 86 devices, each built with individual circuit boards.
ACCESSION #
55412523

 

Related Articles

  • Power IC Packaging. Brown, Clem; Shumway, Russell // Advanced Packaging;Oct2003, Vol. 12 Issue 10, p23 

    Describes trends and developments in integrated circuit packaging. Comparison of the power quad flat-pack no-lead package technology with the existing power integrated circuit package; Properties of both packaging systems; Improvement of thermal performance, manufacturability and flexibility...

  • USE COMMON SENS(ORS). Anders, Geoff // NZ 4WD;Jun2008, Vol. 13 Issue 3, p60 

    The author offers information on Surface Mount Technology (SMT), a method for constructing electronic circuits. He offers a brief detail on the evolution of SMT and discusses how it is assembled. After citing the benefits, the author presents the downsides of the technology. He believes that...

  • Interconnects and Their Effect on Automated SMT Placement. Moberg, Frederik // Circuits Assembly;Aug2006, Vol. 17 Issue 8, p32 

    The article discusses the effect of interconnects on automated surface mount technology placement. Connectors come in all sorts of shapes and sizes and fulfill interconnection needs. Technical developments are continuing and many are aimed at making connectors into true surface-mount components....

  • Next-generation Packaging Materials. Tummala, Rao; Markondeya, P.; Sundaram, Venky // Advanced Packaging;Jun2004, Vol. 13 Issue 6, p26 

    Discusses developments in package/board materials and processes that can support convergent electronic systems with computing, communication, consumer and biomedical functions. Emergence of package integration approaches such as system in package, 3-D chip and package stacking and multichip...

  • 3-D-stacked ICs with Copper Nails. Swinnen, Bart; Beyne, Eric // Advanced Packaging;Feb2006, Vol. 15 Issue 2, p27 

    The article focuses on 3-d (3-D) integration technology which allows system-size reduction in area and volume, improving packaging density for applications such as handheld products. This technology improves performance because interconnects in a 3-D assembly are shorter than in a 2-dimensional...

  • PCB Designers Notebook: Reducing Occurrence of Voids in Solder Balls. Solberg, Vern // SMT: Surface Mount Technology;May2004, Vol. 18 Issue 5, p18 

    Discusses ways to reduce occurrence of voids in solder balls. Effect of voids on product reliability; Tool used for observing voiding in solder ball; Reasons why voids occur.

  • Key Considerations in Selective Soldering. Prasad, Ray P. // SMT: Surface Mount Technology;Aug2004, Vol. 18 Issue 8, p16 

    Discusses key factors to consider in selective soldering. Selective soldering of through-hole components; Selective soldering of surface mount technology components; Ability to solder moisture-sensitive components without baking.

  • Mixed-Technology Boards. Berntson, Ross B.; Lasky, Ronald; Pfluke, Karl P. // SMT: Surface Mount Technology;Aug2004, Vol. 18 Issue 8, p28 

    Describes three methods used for through-hole connector attachment on double sided surface mount technology printed circuit boards. Selective wave solder process; Pin-in-paste (PIP) reflow process; Illustration of how the solder perform process is an alternative when PIP provides insufficient...

  • October.  // SMT: Surface Mount Technology;Oct2004, Vol. 18 Issue 10, p4 

    Presents a calendar of events that lists congresses and conventions organized by the trade and professional organizations in the field of surface mount technology in the U.S. and in other countries for the month of October 2004.

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics