TITLE

For copper processes

AUTHOR(S)
Banerjee, Gautam; So, Joseph; Mikkola, Bob
PUB. DATE
November 2001
SOURCE
Solid State Technology;Nov2001, Vol. 44 Issue 11, p83
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Examines the optimization of electroplating and planarization process for copper process. Simultaneous optimization; Experimental method; Results of the post-CMP cleaning.
ACCESSION #
5476125

 

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