TITLE

Dynamical growth behavior of copper clusters during electrodeposition

AUTHOR(S)
Pei-Cheng Hsu; Yong Chu; Jae-Mock Yi; Cheng-Liang Wang; Syue-Ren Wu; Hwu, Y.; Margaritondo, G.
PUB. DATE
July 2010
SOURCE
Applied Physics Letters;7/19/2010, Vol. 97 Issue 3, p033101
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer.
ACCESSION #
52479434

 

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