TITLE

NXP Upsizes Bond Deal to $1B

AUTHOR(S)
Sheahan, Matthew
PUB. DATE
July 2010
SOURCE
High Yield Report;7/19/2010, Vol. 21 Issue 29, p7
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article reports that NXP Semiconductors has increased its bond offering to 1 billion dollars from 600 million dollars as it prepares to issue the notes in a potential drive-by deal on July 20, 2010.
ACCESSION #
52384059

 

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