TITLE

Polymer bonding process for nanolithography

AUTHOR(S)
Borzenko, T.; Tormen, M.; Schmidt, G.; Molenkamp, L. W.; Janssen, H.
PUB. DATE
October 2001
SOURCE
Applied Physics Letters;10/1/2001, Vol. 79 Issue 14, p2246
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We have developed a lithography process which originates from imprint lithography and offers advantages over it. Unlike imprint lithography, not only the sample but also the mold is covered with a thermoplastic polymer. The mold and sample are brought into contact, pressed together and heated above the glass transition temperature of the thermoplast, causing the two polymer layers to become bonded (glued) together. A special treatment of the mold and sample surface causes the polymer film to stick only to the substrate after cooling. The bonding occurs at pressures and temperatures lower than those usually applied in imprint technology, and eliminates problems in conventional imprint technology that are related to lateral transport of the polymer. © 2001 American Institute of Physics.
ACCESSION #
5227935

 

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