TITLE

In situ evolution of stress gradients in Cu films induced by capping layers

AUTHOR(S)
Murray, Conal E.; Besser, Paul R.; Witt, Christian; Toney, Michael
PUB. DATE
June 2010
SOURCE
Applied Physics Letters;6/28/2010, Vol. 96 Issue 26, p261903
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Depth-dependent stress distributions within copper films possessing capping layers were measured during in situ thermal anneals. Glancing-incidence x-ray diffraction measurements of SiCxNyHz capped Cu films revealed that a strain gradient near the cap/Cu interface, created by constraint imposed by the cap during its deposition process, decreased as the sample temperature increased to 350 °C. Although the increase in sample temperature allowed Cu to approach its equilibrium lattice spacing at the cap deposition temperature and minimize the corresponding stress gradient, both the gradient and concomitant increase in residual bulk stress of the Cu film reappeared after cooling to room temperature.
ACCESSION #
51975724

 

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