TITLE

Enhanced photogeneration of carriers in a semiconductor via coupling across a nonisothermal nanoscale vacuum gap

AUTHOR(S)
DiMatteo, R. S.; Greiff, P.; Finberg, S. L.; Young-Waithe, K. A.; Choy, H. K. H.; Masaki, M. M.; Fonstad, C. G.
PUB. DATE
September 2001
SOURCE
Applied Physics Letters;9/17/2001, Vol. 79 Issue 12, p1894
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Enhanced generation of carriers when a thermophotovoltaic cell is placed in submicron proximity to a heated surface is demonstrated using custom-designed InAs photodiodes and special silicon-based heater chips produced using microelectromechanical system techniques. The short-circuit current of the photocells is shown to increase sharply (up to fivefold) when the spacing between the heater and photodiode surfaces is reduced, while at the same time, the heater temperature decreases, consistent with increased radiative transfer between the two surfaces. By varying the spacing sinusoidally (at up to 1 kHz), it is demonstrated that the increase in the short-circuit current occurs in phase with the decrease in separation, thereby ruling out thermal effects. It is argued that the increase in short-circuit current is due to increased evanescent coupling of blackbody radiation from the hot surface to the cold photocell, consistent with recent theoretical predictions. The demonstration of this effect is the initial step in the development of a class of energy conversion devices. © 2001 American Institute of Physics.
ACCESSION #
5145187

 

Related Articles

  • 3D and MEMS Packaging Technologies - Gaining Traction. Caswell, Greg // Advancing Microelectronics;May2010, Vol. 37 Issue 3, p5 

    The article discusses various reports published within the issue including the advances in through silicon vias (TSVs), the Fan-In Wafer Level Packaging approach, and the reliability of microelectromechanical systems (MEMS).

  • Just when you thought it couldn't get any smaller. Frueh, George // ECN: Electronic Component News;Sep99, Vol. 43 Issue 9, p10 

    Focuses on the development of Micro Electro Mechanical Systems devices for use in electronic industries. Application of the technology in micro-motors, micro-gears and micro-mirrors; Potential use of the technology in different industries.

  • STICTION AND MEMS RELIABILITY. O'Reilly, Rob // EDN;10/11/2001, Vol. 46 Issue 23, p48 

    Focuses on the reliability and stiction of microelectromechanical system (MEMS) devices. Use of semiconductor equipment for construction of MEMS devices; Concerns on the stiction of microelectromechanical systems; Provision of processing changes for suppliers producing commercial MEMS in...

  • Light Duty: Managing MOEMS. Gilleo, Ken // Electronic News;03/05/2001, Vol. 47 Issue 10, p44 

    Reports on the emergence of micro-optoelectromechanical systems (MOEMS) in semiconductor packaging. Features of MOEMS; Similarity between MOEMS and microelectromechanical system; Vendors offering novel packaging solutions for MOEMS.

  • Strain against the machine. Chen, Josette // Nature;5/17/2001, Vol. 411 Issue 6835, p252 

    Focuses on microelectromechanical systems (MEMS) devices that use elastic strain to make a hinge. Advantage of making devices in three dimensions; Role of semiconductors in forming MEMS devices.

  • wafer-level MEMS packaging. Teomim, Doron; Badihi, Avner; Zilber, Gil // Solid State Technology;Jan2002, Vol. 45 Issue 1, p57 

    Talks about a wafer-level chip-scale package that provides an integrated cavity above the active area of a microelectromechanical systems (MEMS) device. Devices with mechanically moving components that will benefit from the package; Description of a spacer rim; Features of the package.

  • Study of Electrode Wear Ratio of Piezoelectric Self-adaptive Micro-EDM. Dezheng Kong; Qinhe Zhang; Xiuzhuo Fu; Ya Zhang // Key Engineering Materials;2014, Vol. 589/590, p505 

    Micro Electrical discharge machining (Micro-EDM) is a non-traditional concept of machining. It is very suitable for machining micro parts of Micro-electromechanical Systems (MEMS). However, the application of micro-EDM is restricted for its own shortcomings such as poor material removal rate and...

  • MEMS and compound semiconductors: Ready to take off? Fitzgerald, Kevin // Solid State Technology;Nov2003, Vol. 46 Issue 11, p55 

    Reports on the prospects of microelectrochemical systems (MEMS) and compound semiconductors in global markets. Unit growth of worldwide market for MEMS in 2002; Large automotive market for MEMS; Processing challenges. INSET: Compound semiconductors.

  • Steady-state Nyquist theorem for multi-terminal nondegenerate semiconductor devices. Lee, J. B.; Min, H. S.; Park, Y. J. // Journal of Applied Physics;6/15/1994, Vol. 75 Issue 12, p8182 

    Deals with a steady-state Nyquist theorem for multi-terminal nondegenerate semiconductor devices. Derivation of formulas for the spectral intensities of the short-circuit thermal noise currents in arbitrarily shaped multi-terminal semiconductor devices under direct current bias; Experimental...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics