TITLE

Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer

AUTHOR(S)
Lu, C. T.; Tseng, H. W.; Chang, C. H.; Huang, T. S.; Liu, C. Y.
PUB. DATE
June 2010
SOURCE
Applied Physics Letters;6/7/2010, Vol. 96 Issue 23, p232103
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
In this study, Ni(P) bond pads joined with Sn solder bumps were stressed with a high current density of 104 A/cm2. Serious electromigration-induced Ni(P) consumption and unusual EM-enhanced diffusion of the interfacial Ni3Sn4 compound layer are observed. However the observed EM-induced Ni(P) consumption and EM-enhanced diffusion of the interfacial Ni3Sn4 compound layer can be effectively retarded by introducing an additional electroless Pd layer on the Ni(P) layer. The improvement in EM resistance due to the Pd layer can be attributed to PdSn4 formation and Pd solutes in the interfacial Ni3Sn4 layer.
ACCESSION #
51378967

 

Related Articles

  • First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder. Yu, Chun; Lu, Hao // Journal of Applied Physics;9/1/2007, Vol. 102 Issue 5, p054904 

    First-principles calculations were performed to investigate the mechanisms of Cu and Ag improving the electromigration resistance of Sn-based solder. The calculated diffusion activation energies in both Sn31Cu and Sn31Ag were higher than that in Sn32. The barrier energy of the first nearest...

  • Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing. Chih-Ming Chen; Chih-Chieh Huang; Chien-Neng Liao; Kuen-Ming Liou // Journal of Electronic Materials;Jul2007, Vol. 36 Issue 7, p760 

    Effects of Cu doping on the microstructural evolution in the eutectic SnBi solder stripes under annealing and current stressing were investigated. Coarsening of the Bi grains was observed in the eutectic SnBi solder upon annealing at 85°C. Doping of 1 wt.% Cu could significantly reduce the...

  • Improving Lead-free Solder Reliability. MILAD, GEORGE // Printed Circuit Design & Manufacture;Dec2008, Vol. 25 Issue 12, p22 

    The article discusses electroless nickel/electroless palladium/immersion gold (ENEPIG), a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys. It is noted that ENEPIG forms a robust, higher strength solder joint with SAC 305 LF alloy...

  • Effect of Zn doping on SnAg solder microstructure and electromigration stability. Lu, Minhua; Shih, Da-Yuan; Kang, Sung K.; Goldsmith, Charles; Flaitz, Philip // Journal of Applied Physics;Sep2009, Vol. 106 Issue 5, p053509 

    A comprehensive study on the effect of Zn-doped SnAg solders on microstructure and electromigration (EM) is reported. Minor Zn doping, about 0.6 wt %, in a SnAg solder alloy is found to be effective in stabilizing solder microstructure and improving EM reliability. Early EM failure modes in...

  • Current-induced growth of P-rich phase at electroless nickel/Sn interface. Qiliang Yang; Panju Shang; Guo, Jing D.; Zhiquan Liu; Jian-Ku Shang // Journal of Materials Research;Sep2009, Vol. 24 Issue 9, p7 

    The role of high current stressing during growth of the P-rich phase at the electroless Ni/Sn interface was examined by transmission electron microscopy. Prior to current stressing, two layers of Ni12P5, columnar Ni12P5 and noncolumnar Ni12P5, were formed after soldering. Upon electric...

  • Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes. Wei, C. C.; Liu, C. Y. // Journal of Materials Research;Aug2005, Vol. 20 Issue 8, p2072 

    Using Blech's structure, we studied the electromigration (EM) behaviors of four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1Ni. The order of the EM rates was determined to be Sn0.7Cu > Sn > Sn3Cu > Sn1Ni. We believe that the lower yielding strength and higher grain...

  • Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder. Gain, Asit; Zhang, Liangchi // Journal of Materials Science: Materials in Electronics;Jan2016, Vol. 27 Issue 1, p781 

    This paper investigates the effects of Ni nanoparticles on the formation of intermetallic compound (IMC) layers and mechanical properties of low melting temperature Sn-58Bi (wt%) based solders on copper (Cu) substrate. At the initial reaction for the plain Sn-Bi solder/Cu substrate system, an...

  • Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu- xPd System. Ho, C.; Hsu, L.; Lin, S.; Rahman, M. // Journal of Electronic Materials;Jan2012, Vol. 41 Issue 1, p2 

    The interfacial reaction between Ni and Sn-3Ag-0.5Cu- xPd alloys ( x = 0 wt.% to 1 wt.%) at 250°C and the mechanical reliability of the solder joints were investigated in this study. The reaction and the resulting mechanical properties were both strongly dependent on the Pd concentration....

  • ENEPIG: A Final Finish That's Time Has Come. Milad, George // CircuiTree;May2010, Vol. 23 Issue 5, p16 

    The article discusses the benefits of the surface finish product electroless nickel/electroless palladium/immersion gold (ENEPIG). Studies conducted to assess the reliability of the solder joint formed on an ENEPIG surface finish with LF solder and LF assembly conditions, the optimum thickness...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics