TITLE

Thermal energy consideration in micromagnetic simulation for laminated antiferromagnetically coupled recording media

AUTHOR(S)
Hee, C. H.; Wang, J. P.; Piramanayagam, S. N.; Chong, T. C.
PUB. DATE
September 2001
SOURCE
Applied Physics Letters;9/10/2001, Vol. 79 Issue 11
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Contribution of thermal energy, has been included in the micromagnetic simulation of laminated antiferromagnetically coupled (LAC) media. The antiferromagnetic coupling constant, J, required to obtain M[sub r]t reduction in the existing simulation studies (T=0 K) of LAC media is much higher than the experimental values. In this letter, we describe some experimental results, which point out that the contribution of thermal energy in M[sub r]t reduction is significant. Consequently, we find that the values of J and the reversal fields are comparable to the experimental results, when thermal energy (T=300 K) is included in the simulation. © 2001 American Institute of Physics.
ACCESSION #
5113212

 

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