TITLE

Strain induced suppression of silver agglomeration of indium-containing silver contact

AUTHOR(S)
Gwan Ho Jung; Jun Ho Son; Yang Hee Song; Jong-Lam Lee
PUB. DATE
May 2010
SOURCE
Applied Physics Letters;5/17/2010, Vol. 96 Issue 20, p201904
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
The mechanism for thermally stable indium-containing silver [Ag(In)] Ohmic contact on p-type GaN has been investigated. The specific contact resistivity as low as 3.8×10-5 Ω cm2 and a high reflectance of 88.4% at a 460 nm wavelength were obtained by annealing Ag(0.5 wt % In) alloy contact at 450 °C in air ambient. The In atoms in Ag matrix made In–O chemical bonds, producing a tensile stress in the film. This compensated thermal compressive stress built in the Ag film. As a result, In atoms in Ag film play a role in preventing Ag contact from agglomeration, leading to high reflectance and good thermal stability.
ACCESSION #
50827853

 

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