TITLE

Hollow tin/chromium whiskers

AUTHOR(S)
Jing Cheng; Vianco, Paul T.; Li, James C. M.
PUB. DATE
May 2010
SOURCE
Applied Physics Letters;5/3/2010, Vol. 96 Issue 18, p184102
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Tin whiskers have been an engineering challenge for over five decades. The mechanism has not been agreed upon thus far. This experiment aimed to identify a mechanism by applying compressive stresses to a tin film evaporated on silicon substrate with an adhesion layer of chromium in between. A phenomenon was observed in which hollow whiskers grew inside depleted areas. Using focused ion beam, the hollow whiskers were found to contain both tin and chromium. At the bottom of the depleted areas, thin tin/tin oxide film remained over the chromium layer. It indicates that tin transport occurred along the interface between tin and chromium layers.
ACCESSION #
50309208

 

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