Thin Film Diamond Advances the Semiconductor Industry
Tags: DIAMONDS; THIN films; SEMICONDUCTORS -- Thermal properties; MICROELECTROMECHANICAL systems; ELECTROMECHANICAL devices; SEMICONDUCTOR industry
Related Articles
- MEMS applications using diamond thin films. Huff, Michael A.; Aidala, Dwain A.; Butler, James E. // Solid State Technology;Apr2006, Vol. 49 Issue 4, p45
The article focuses on microelectromechanical system applications using diamond thin films. Thin film diamonds offers enhanced mechanical properties, including higher stiffness, strength, hardness, thermal conductivity and chemical robustness compared to silicon and other thin film materials...
- Growth stresses and viscosity of thermal oxides on silicon and polysilicon. Kahn, H.; Jing, N.; Huh, M.; Heuer, A. H. // Journal of Materials Research;Jan2006, Vol. 21 Issue 1, p209
Stresses in thermally grown SiO2 films on silicon have traditionally been determined by substrate curvature measurements. This technique is useful for studying stresses in thin films, but it cannot be used to investigate stresses generated in the substrate during film growth. In the present...
- Electroplated CoFe thin films for electromagnetic microactuators. Bedenbecker, Matthias; Gatzen, Hans H. // Journal of Applied Physics;4/15/2006, Vol. 99 Issue 8, p08M308
To replace NiFe alloys used as flux guides in magnetic microelectromechanical systems, electroplated CoFe thin films were examined. The films were deposited using pulse plating. The results show a strong influence of the reverse current Ireverse on the deposition rate and the saturation flux...
- Standard Open Tool Packages for MEMS-enabled Products. Da Silva, Mark // Advanced Packaging;Sep2004, Vol. 13 Issue 9, p26
Discusses standard open tool packages for microelectromechanical system (MEMS) devices. Packaging costs of MEMS devices; Difference between packaging MEMS components from microelectronics; MEMS packaging complexity; Packaging during the design phase.
- MEMS Packaging Update. Gilleo, Ken // Advanced Packaging;Sep2005, Vol. 14 Issue 9, p20
Provides an overview on the advancements in microelectromechanical systems (MEMS) packaging. Popularity of motion sensors; Advantages of ink-jet chips; Applications for inertial sensors; Surface machining process.
- MEMS And Nano Push For Higher System Integration Levels. Allan, Roger // Electronic Design;1/14/2010, Vol. 58 Issue 1, p73
The article discusses the move of the microelectromechanical systems (MEMS) industry to integrate with higher systems particularly the use of nano-sized devices in the U.S. It explores the significance and benefits of the industry's coordination with nano devices to enable and extend MEMS' usage...
- MEMS-DESIGN SOFTWARE PROVIDES EDA APPROACH. Moretti, Gabe // EDN;7/8/2004, Vol. 49 Issue 14, p20
The article deals with the release of the CoventorWare suite by Coventor, a provider of tools for the development of microelectromechanical systems (MEMS), microfluidics and semiconductor process applications. The tools allow developers to combine MEMS models with electronic models they...
- Engineering MICROSCOPES ZOOM IN ON DEFECTS. Mendelsohn, Alex // Test & Measurement World;Dec2007/Jan2008, Vol. 27 Issue 11, p43
The article discusses the effect of microscopy systems on the way engineers develop and test semiconductors and materials, as well as technologies like microelectromechanical systems (MEMS). Terrence Lundy, vice president and managing director at Hyphenated Systems, stresses that the combination...
- Preparation of PbZrO3 thin films by plasma enhanced metalorganic chemical vapor deposition. Lee, Won Gyu; Woo, Seong Ihl // Journal of Materials Science Letters;Dec2003, Vol. 22 Issue 23, p1677
The article reports that the research in the area of ferroelectric thin films is growing fast due to their possible applications in the areas of microelectronic and microelectromechanical systems. Various techniques for the preparation of ferroelectric thin films such as reactive magnetron...
