TITLE

Response to “Comment on ‘Effect of current crowding on vacancy diffusion and void formation in electromigration’ ” [Appl. Phys. Lett. 79, 1061 (2001)]

AUTHOR(S)
Tu, K. N.
PUB. DATE
August 2001
SOURCE
Applied Physics Letters;8/13/2001, Vol. 79 Issue 7
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Responds to the comment on the effect of current crowding on vacancy diffusion and void formation in electromigration. Issues on Z vacancies; Matters related to the alternating current mode of electromigration; Effect of steady state stress on vacancy diffusion and void formation.
ACCESSION #
4972057

 

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