III-V-semiconductor-on-insulator n-channel metal-insulator-semiconductor field-effect transistors with buried Al2O3 layers and sulfur passivation: Reduction in carrier scattering at the bottom interface

Yokoyama, Masafumi; Yasuda, Tetsuji; Takagi, Hideki; Miyata, Noriyuki; Urabe, Yuji; Ishii, Hiroyuki; Yamada, Hisashi; Fukuhara, Noboru; Hata, Masahiko; Sugiyama, Masakazu; Nakano, Yoshiaki; Takenaka, Mitsuru; Takagi, Shinichi
April 2010
Applied Physics Letters;4/5/2010, Vol. 96 Issue 14, p142106
Academic Journal
We have developed III-V-semiconductor-on-insulator (III-V-OI) structures on Si wafers with excellent bottom interfaces between In0.53Ga0.47As-OI channel layers and atomic-layer-deposited Al2O3 (ALD-Al2O3) buried oxides (BOXs). A surface activated bonding process and the sulfur passivation pretreatment have realized the excellent In0.53Ga0.47As-OI/ALD-Al2O3 BOX bottom interface properties. As a result, the III-V-OI n-channel metal-insulator-semiconductor field-effect transistors under the back-gate configuration showed the peak mobility of 1800 cm2/V s and the higher electron mobility than the Si universal one even in the high effective electric field range because of the reduction in the surface roughness and fixed charges.


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