Transport and structural properties of the top and bottom grain boundaries in YBa[sub 2]Cu[sub 3]O[sub 7-δ] step-edge Josephson junctions

Lombardi, Filomena; Ivanov, Z. G.; Fischer, G. M.; Olsson, E.; Claeson, T.
January 1998
Applied Physics Letters;1/12/1998, Vol. 72 Issue 2
Academic Journal
We present a method to study separately the electrical transport properties of the grain boundaries (GBs) formed at the top and at the bottom edges of YBa[sub 2]Cu[sub 3]O[sub 7-δ](YBCO) step-edge Josephson junctions. The step-edge junctions were fabricated on (100) LaAlO[sub 3] steps using tilted Ar ion milling to define the electrodes and the microbridges. Due to the shadowing effect of the step, a continuous YBCO stripe remains along and at the bottom of the step on both sides of a microbridge. We found that the top GB is responsible for the weak link behavior of our step-edge junctions. The transport properties were correlated with the different microstructural properties of the two GBs formed at the edges of the step. © 1998 American Institute of Physics.


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