Anodically bonded submicron microfluidic chambers

Dimov, S.; Bennett, R. G.; Córcoles, A.; Levitin, L. V.; Ilic, B.; Verbridge, S. S.; Saunders, J.; Casey, A.; Parpia, J. M.
January 2010
Review of Scientific Instruments;Jan2010, Vol. 81 Issue 1, p013907
Academic Journal
We demonstrate the use of anodic bonding to fabricate cells with characteristic size as large as 7×10 mm2, with height of ≈640 nm, and without any internal support structure. The cells were fabricated from Hoya SD-2 glass and silicon wafers, each with 3 mm thickness to maintain dimensional stability under internal pressure. Bonding was carried out at 350 °C and 450 V with an electrode structure that excluded the electric field from the open region. We detail fabrication and characterization steps and also discuss the design of the fill line for access to the cavity.


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