TITLE

Electrically interconnected assemblies of microscale device components by printing and molding

AUTHOR(S)
Mo Joon Kim; Jongseung Yoon; Sang-Il Park; Rogers, John A.
PUB. DATE
November 2009
SOURCE
Applied Physics Letters;11/23/2009, Vol. 95 Issue 21, p214101
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
This letter presents approaches for assembly and electrical interconnection of micro/nanoscale devices into functional systems with useful characteristics. Transfer printing techniques provide deterministic control over an assembly process that occurs prior to or simultaneously with a soft lithographic molding step that defines relief features in a receiving polymer. Filling these features with conducting materials that are processable in the form of liquids or pastes yields integrated interconnects and contacts aligned to the devices. Studies of the underlying aspects and application to representative systems in photovoltaics and solid state lighting indicators provide insights into the process and its practical use.
ACCESSION #
45478112

 

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