Weak-link behavior of grain boundaries in superconducting Ba(Fe1-xCox)2As2 bicrystals

Lee, S.; Jiang, J.; Weiss, J. D.; Folkman, C. M.; Bark, C. W.; Tarantini, C.; Xu, A.; Abraimov, D.; Polyanskii, A.; Nelson, C. T.; Zhang, Y.; Baek, S. H.; Jang, H. W.; Yamamoto, A.; Kametani, F.; Pan, X. Q.; Hellstrom, E. E.; Gurevich, A.; Eom, C. B.; Larbalestier, D. C.
November 2009
Applied Physics Letters;11/23/2009, Vol. 95 Issue 21, p212505
Academic Journal
We show that despite the low anisotropy, strong vortex pinning, and high irreversibility field Hirr close to the upper critical field Hc2 of Ba(Fe1-xCox)2As2, the critical current density Jgb across [001] tilt grain boundaries (GBs) of thin film Ba(Fe1-xCox)2As2 bicrystals is strongly depressed, similar to high-Tc cuprates. Our results suggest that weak-linked GBs are characteristic of both cuprates and pnictides because of competing orders, low carrier density, and unconventional pairing symmetry.


Related Articles

  • Collection of electron-beam-generated carriers in the presence of a grain boundary or an epitaxial interface. Paz, O.; Borrego, J. M. // Journal of Applied Physics;2/15/1987, Vol. 61 Issue 4, p1537 

    Presents a study wherein an electron-beam-induced-current technique was extended to the case where the grain size is less than the diffusion length. Effect of grain boundary on carrier transport; Comparison of the measured grain size and the calculated grain-boundary-recombination velocity;...

  • Grain-Boundary Diffusion in Nanocrystals with a Time-Dependent Diffusion Coefficient. Nazarov, A. A. // Physics of the Solid State;Jun2003, Vol. 45 Issue 6, p1166 

    A solution to the equation of grain-boundary diffusion is obtained under conditions where migration of the diffusant from the boundaries into the grains is absent and the diffusion coefficient decreases with time from an increased value to a value characteristic of equilibrium grain boundaries....

  • Effects of deformation on the crystal field parameter of the Nd ions in Nd2Fe14B. Tsuneaki Suzuki; Yuta Toga; Akimasa Sakuma // Journal of Applied Physics;2014, Vol. 115 Issue 17, p17A703-1 

    Recently, the reduced coercivity of sintered Nd-Fe-B magnets was explained by distortion of the Nd-Fe-B region at the grain boundaries using classical molecular dynamics and phenomenological theory regarding magnetoelastic anisotropy. In this paper, we investigate how the deformation of Nd2Fe14B...

  • Direct determination of grain-boundary and dislocation self-diffusion coefficients in silver from experiments in type-C kinetics. Sommer, J.; Herzig, Chr. // Journal of Applied Physics;10/1/1992, Vol. 72 Issue 7, p2758 

    Describes measurements of grain-boundary self-diffusion in silver polycrystals under type-C and -B conditions. Theoretical background; Experimental details; Results and discussion.

  • Preface.  // Defect & Diffusion Forum;2013, Vol. 333, p1 

    An introduction is presented in which the editor discusses various reports within the issue on topics including oxides diffusion, mass transport, and grain boundary diffusion.

  • Growth and subsequent relaxation of the anisotropic structure of amorphous Tb-Fe (abstract). Hellman, F.; Robson, M. C.; Messer, M. T. // Journal of Applied Physics;5/15/1994, Vol. 75 Issue 10, p6870 

    Presents an abstract of the study 'Growth and Subsequent Relaxation of the Anisotropic Structure of Amorphous Tb-Fe,' by F. Hellman, M.C. Robson and M.T. Messer.

  • Characteristic features of diffusion-controlled processes in ordinary and ultrafine-grained polycrystaline metals. Kolobov, Yu.; Ratochka, I.; Ivanov, K.; Lipnitskii, A. // Russian Physics Journal;Aug2004, Vol. 47 Issue 8, p840 

    An analysis of manifestation of the effect of acceleration of creep in polycrystalline metals and alloys in the presence of grain-boundary diffusion fluxes of an impurity from an external medium (coating) is performed. The influence of the softened (due to impurity diffusion fluxes) layer...

  • On the root cause of Kirkendall voiding in Cu3Sn. Liang Yin; Borgesen, Peter // Journal of Materials Research;2/14/2011, Vol. 26 Issue 3, p455 

    Soldering to Cu interconnect pads with Sn-containing alloys usually leads to the formation of a layered Cu3Sn/Cu6Sn5 structure on the pad/solder interface. Frequently, microscopic voids within Cu3Sn have been observed to develop during extended thermal aging. This phenomenon, commonly referred...

  • Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization. Tsai, Ming-Hung; Wang, Chun-Wen; Lai, Chia-Han; Yeh, Jien-Wei; Gan, Jon-Yiew // Applied Physics Letters;2/4/2008, Vol. 92 Issue 5, p052109 

    Results on copper metallization diffusion barriers using high-entropy alloy (HEA) nitride are reported. The HEA nitride (AlMoNbSiTaTiVZr)50N50 is amorphous in the as-deposited state and remains its noncrystallinity up to a high temperature of 850 °C. To evaluate its diffusion barrier...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics