Homologous temperature dependence of global surface scaling behaviors of polycrystalline copper films

Yang, J. J.; Liu, B.; Wang, Y.; Xu, K. W.
November 2009
Applied Physics Letters;11/9/2009, Vol. 95 Issue 19, p194104
Academic Journal
A strategy integrating structure zone model with dynamic scaling theory was proposed to study the global surface dynamics of polycrystalline Cu films deposited at different homologous temperature Ts/Tm. The evolution of roughness exponent α and growth exponent β reveals a transition from random deposition to surface diffusion dominated smoothening in the lower Ts/Tm regime and then to rapid surface roughening in the higher Ts/Tm regime. In contrast to that of amorphous films, the distinct scaling behavior in higher Ts/Tm regime arises from the change of anisotropic mass transport mechanisms, which could be related to the texture evolution during growth.


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