Microscopic evaluation of contaminants in ultra-high purity copper

Hoppe, E. W.; Mintzer, E. E.; Aalseth, C. E.; Edwards, D. J.; Farmer, III, O. T.; Fast, J. E.; Gerlach, D. C.; Liezers, M.; Miley, H. S.
October 2009
Journal of Radioanalytical & Nuclear Chemistry;Oct2009, Vol. 282 Issue 1, p315
Academic Journal
Copper is one of few elements that have no long-lived radioisotopes and which can be electrodeposited to ultra-high levels of purity. Experiments probing neutrino properties and searching for direct evidence of dark matter require ultra-clean copper, containing the smallest possible quantities of radioactive contaminants. Important to the production of such copper is establishing the location and dispersion of contamination within the bulk material. Co-deposition of contaminants during copper electrodeposition and its relationship to nucleation and growth processes were investigated using scanning electron microscopy (SEM), laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS), and secondary ionization mass spectrometry (SIMS).


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