TITLE

Production of monodispersed micron-sized bubbles at high rates in a microfluidic device

AUTHOR(S)
Chuanpin Chen; Yonggang Zhu; Leech, Patrick W.; Manasseh, Richard
PUB. DATE
October 2009
SOURCE
Applied Physics Letters;10/5/2009, Vol. 95 Issue 14, p144101
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
A polydimethylsiloxane microchip consisting of a T-junction microchannel network and a thin glass capillary has been developed for the generation of microbubbles. The glass capillary is used to produce an ultrathin gas jet and to controllably block the straight liquid channel, thereby increasing the local liquid velocity near the intersection. Liquid flow rate, liquid viscosity, gas pressure, and inner diameter of the gas jet are varied to investigate the effect on bubble generation. Bubbles with a diameter down to 4.5 μm can be produced at a high rate of 7.5 kHz using a capillary with an inner diameter of 2 μm.
ACCESSION #
44539753

 

Related Articles

  • On-chip sample preconcentration for integrated microfluidic analysis. Song, Simon; Singh, Anup K. // Analytical & Bioanalytical Chemistry;Dec2005, Vol. 384 Issue 1, p41 

    This article discusses the importance of on-chip sample preconcentration for integrated microfluidic analysis. The advances of microfluidic integrated circuits enabled the miniaturization of several biochemical techniques, which results in faster and cheaper analysis using smaller amounts of...

  • Fabrication of Microfluidic–Nanofluidic Channels with Integrated Electrodes. Subbaiah, Nagaraj Krishna; Jeganathan, Karthick; Shiva, Anitha; Belthur Narayan, Suma; Mahadeva Hegde, Gopalkrishna; Vaswani, Sneh; Kurup, Sindhulakshmi // IETE Technical Review;Feb2016, Vol. 33 Issue 1, p64 

    We report on the fabrication of microfluidc–nanofluidic channels on Si incorporated with embedded metallic interconnects. The device aids the study of motion of dispersed particles relative to the fluid under the influence of spatially uniform electric field. Optical lithography in...

  • Telecom, Datacom & Voice ICs.  // ECN: Electronic Component News;Nov2002, Vol. 46 Issue 12, p43 

    Describes various integrated circuits for telecommunications, data communications and voice transmission protocols. Low power media processor from Atsana Semiconductor Corp.; Voice-over-packet silicon PBX from Mindspeed Technologies.

  • LED Driver ICs Now Available in Low-Profile Package for Fluorescent Tube Replacements.  // Power Electronics Technology Exclusive Insight;2/21/2012, p9 

    The article cites the availability of Integrations' LinkSwitch-PH LED driver integrated circuits (ICs) in the low-profile eSIP (L package) measuring 2 mm high.

  • Silicon Valley direct. Rosen; Frueh, Carol // ECN: Electronic Component News;Dec99, Vol. 43 Issue 12, p51 

    Features several integrated circuits. Raychem Circuit Protection's RYC8000 family of power distribution switches; Fairchild Semiconductor's 74VCXF162835; FIFO memories.

  • No let up in new product introductions. Rosen, Carol // ECN: Electronic Component News;Feb2000, Vol. 44 Issue 2, p31 

    Introduces innovative integrated circuit (IC) products designed for various data and telecommunication applications requiring ultra high speeds and performance. Includes Vitesse Semiconductor Corp.'s VSC7130 and VSC7132 chips for Fibre Channel and Gigabit Ethernet applications; Condor Inc.'s...

  • Integrated circuits.  // EDN;01/20/2000, Vol. 45 Issue 2, p133 

    Features integrated circuit products. Includes Electronic Technology Corp.'s positive voltage regulator; AKM Semiconductor Inc.'s 16-bit stereo codec; Linear Technology Corp.'s hot-swap controller; California Micro Devices' power management devices.

  • new products: Integrated Circuits.  // EDN;09/14/2000, Vol. 45 Issue 19, p199 

    Features several integrated circuits. Low-dropout regulator; Latched sink drivers; Three-port Ethernet switch; Gigabit Ethernet controller.

  • Find defects in IC packages. Hutter // Test & Measurement World;Sep99, Vol. 19 Issue 11, p21 

    Focuses on defects in integrated circuit (IC) packages. Functions of the die-attach material used in an IC; Thermal resistance due to delamination; Absorption of internal stresses.

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics