TITLE

Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling

AUTHOR(S)
Chen, M. W.; Chen, M.W.; Dutta, I.
PUB. DATE
December 2000
SOURCE
Applied Physics Letters;12/25/2000, Vol. 77 Issue 26
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
A method is proposed to measure the plastic deformation of thin metallic films on Si substrates induced by thermal cycling. The cross-sectional profiles of pattern-grown square Al films with a thickness of ∼250 nm and a size of ∼6 μmx6 μm were measured before and after thermal cycling by employing an atomic force microscope. With the assistance of statistical analysis, the change in the size and shape of the thin films were determined. Based on theoretical considerations, the thermal cycling deformation of thin films is attributed to creep and plasticity effects, accommodated by diffusion-controlled interfacial sliding. © 2000 American Institute of Physics.
ACCESSION #
4414870

 

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