Microplow-row lithography and fabrication of submicrometer magnetic structures

Li, S. P.; Li, S.P.; Lebib, A.; Peyrade, D.; Natali, M.; Chen, Y.
October 2000
Applied Physics Letters;10/23/2000, Vol. 77 Issue 17
Academic Journal
This letter describes the use of a microplow-row lithography technique to fabricate wire and dot arrays with submicrometer resolution. Fabrication of patterned magnetic structures with or without resist processing was demonstrated that shows the simplicity and the usefulness of this technique. The performance of the patterned magnetic structures compares favorably with that of similar fabrication by using conventional methods. © 2000 American Institute of Physics.


Related Articles

  • Domain wall diodes in ferromagnetic planar nanowires. Allwood, D. A.; Xiong, Gang; Cowburn, R. P. // Applied Physics Letters;10/4/2004, Vol. 85 Issue 14, p2848 

    We demonstrate a lithographically defined magnetic structure through which domain walls from planar magnetic nanowires propagate in one direction only, under an appropriate magnetic field. This domain wall diode is of the form of an isosceles triangle, with one nanowire emanating from its apex...

  • Magnetization reversal in diamond-shaped pseudo-spin-valve nanomagnets. Goolaup, S.; Adeyeye, A. O.; Singh, N. // Journal of Applied Physics;10/15/2005, Vol. 98 Issue 8, p084318 

    A systematic investigation of the magnetization reversal process of diamond-shaped Ni80Fe20(10 nm)/Cu(tCu nm)/Ni80Fe20(40 nm) pseudo-spin-valve nanostructures is presented. The structures were fabricated on silicon substrate using deep ultraviolet lithography at 248 nm exposing wavelength. By...

  • Thermal stability of patterned Co/Pd nanodot arrays. Tudosa, I.; Lubarda, Marko V.; Chan, K. T.; Escobar, M. A.; Lomakin, Vitaliy; Fullerton, E. E. // Applied Physics Letters;3/5/2012, Vol. 100 Issue 10, p102401 

    We have studied the magnetic reversal and thermal stability of [Co(0.3 nm)/Pd(0.7 nm)]N multilayers patterned into 35-nm-diameter nanodot arrays. The short-time coercive fields are relatively constant with N while the room-temperature thermal stability parameter increases nearly linearly with N....

  • A new offset printing technique. Schmidt, Klaus F. // Print;Mar/Apr95, Vol. 49 Issue 2, p242 

    Discusses the dryographic, or waterless, offset lithographic printing technique. Conventional wet process; Elimination of need for dampening printing plates; History of dryographic printing.

  • Experience in color printing. Gamble, H. // Arts & Activities;Nov91, Vol. 110 Issue 3, p22 

    Tells how Jeanette Steck, an art teacher at Plainfield (Indiana) High School developed a four-color printmaking, or lithography, project for her commercial art class and her ninth-grade exploratory art class. Use of Litho-Sketch, a paper-plate lithography process; Local artist David Gamble's...

  • The lithographic print and process. Sheehan, Steven // American Artist;Aug1995, Vol. 59 Issue 637, p10 

    Discusses the mechanics of lithograph. Invention; Uses; Execution methods with the use of equipment like levigator; Graining; Final touches.

  • EUV lithography. Hawryluk, Andrew M.; Ceglio, Natale M. // Solid State Technology;Aug97, Vol. 40 Issue 8, p75 

    Part II. Discusses various aspects of extreme ultraviolet (EUV) lithography. Reticle technologies; Source technologies; Resist technologies; Photograph of a coating tool for fabricating EUV reticle blanks; Phases of the development of the plasma source.

  • Optimizing i-line lithography for 0.3-mum poly-gate manufacturing. Finders, Jo; Tzviatkov, Plamen // Solid State Technology;Mar97, Vol. 40 Issue 3, pS5 

    Discusses how to optimize i-line lithography for 0.3-mum poly-gate manufacturing. Process characterization by scanning electron microscope inspection; Capabilities of i-line lithography; Use of automated electrical linewidth measurements to measure the after-etch process window.

  • EUV lithography. Hawryluk, Andrew M.; Ceglio, Natale M. // Solid State Technology;Jul97, Vol. 40 Issue 7, p151 

    Part IV. Focuses on various aspects of extreme ultraviolet lithography (EUVL). Origin; Companies involved in the development of the technology; Concepts in EUVL; Technical baseline values; Scanner performance requirements; Applications; Cost.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics