Multilayer barrier films comprising nitrogen spacers between free-standing barrier layers

Granstrom, Jimmy; Villet, Michael; Chatterjee, Tirtha; Gerbec, Jeffrey A.; Jerkunica, Evan; Roy, Anshuman
August 2009
Applied Physics Letters;8/31/2009, Vol. 95 Issue 9, p093306
Academic Journal
An encapsulation architecture for organic electronic devices utilizing nitrogen gas-phase spacers between free-standing barrier films is demonstrated. The nitrogen spacers act as sinks for permeating H2O and O2, delaying establishment of steady-state chemical potential gradients across the barriers and thereby reducing permeation rates. Water vapor transmission through nitrogen-spaced barriers was measured via the calcium optical transmission test. Substantial reductions in permeation rate were observed for a variety of barrier materials and configurations, suggesting a general and cost-effective approach for improving encapsulation performance. A low-cost polyethylene terephthalate film increases the calcium lifetime of a Cytopâ„¢-Kureha structure from 7000 to 12000 min.


Related Articles

  • Rheology of polysiloxanes filled with getter particles: Effect on moisture adsorption in organic electronics. Gigli, J.; Mudu, M.; Vacca, P.; Bonucci, A.; Giannantonio, R.; Tominetti, S. // AIP Conference Proceedings;7/11/2012, Vol. 1459 Issue 1, p136 

    Organic electronic devices are extremely sensitive to moisture and they need to be protected through the adoption of an encapsulation package. The use of suitable getter materials can maintain the moisture concentration at an extremely low values, assuring a constant efficiency for a long time....

  • Ukrainian PET market.  // CIREC Monthly News;Jun2013, Issue 270, p20 

    The article discusses the decline of Ukrainian polyethylene terephthalate (PET) market due to a number of factors.

  • Influence of Plasma Treatments on the Hemocompatibility of PET and PET  TiO2 Films. Ionut Topala; Nicoleta Dumitrascu; Valentin Pohoata // Plasma Chemistry & Plasma Processing;Feb2007, Vol. 27 Issue 1, p95 

    Abstract??A dielectric barrier discharge (DBD) in helium was used to ameliorate the interface between the blood and the surface of polymeric implants: polyethylene terephthalate (PET) and PET with titanium oxide (PET??TiO2).A higher crystallinity degree was found for the DBD treated samples. The...

  • Melt-spun poly(tetrafluoroethylene) fibers. Goessi, Matthias; Tervoort, Theo; Smith, Paul // Journal of Materials Science;Oct2007, Vol. 42 Issue 19, p7983 

    The recent discovery of melt-processable poly(tetrafluoroethylene) (PTFE) allows for common thermoplastic-polymer processing technologies to be applied to this unique polymer, which heretofore was considered to be highly intractable. In this paper, we report simple melt-spinning of monofilaments...

  • PET producers feel price pressure. Gibson, Jane // ICIS Chemical Business;5/29/2006, Vol. 1 Issue 21, p34 

    The article offers a look at the polyethylene terephthalate (PET) market in Europe. The May 2006 increases of around £40-€70/tonne have provided some redemption for Europe's PET producers after months of sustained feedstock increases. Although targets as high as €150/tonne had...

  • Return of PETnology.  // Packaging Magazine;5/19/2005, Vol. 8 Issue 10, p24 

    The article reports that the sixth PETnology Forum Europe 2005 will take place at Hotel Palace in Berlin, Germany, on June 13-14, 2005.

  • Hot-Fill Packaging. Grande, Joseph A. // Plastics Technology;Dec2007, Vol. 53 Issue 12, p50 

    The article looks at the development of oriented polypropylene (OPP) bottles. The OPP is re-emerging due to its high-heat capability, light weight, improved clarity and cost competitiveness. The key limiting factor for OPP is gas barrier, and with 30 times the oxygen and carbon dioxide...

  • Use rip cord to remove encapsulant from buried enclosures. Whitson, Samuel M. // Cabling Installation & Maintenance;Jan1997, Vol. 5 Issue 1, p44 

    Presents tips on how to remove encapsulant from buried enclosures. Difficulty of removing an encapsulant from a re-enterable closure; Installation of a rip cord before applying the encapsulant; Procedures involved.

  • High-rel plastic packages offer alternatives to ceramics. Locke, David // Military & Aerospace Electronics;Aug95, Vol. 6 Issue 8, p27 

    Discusses the advantages of high-reliability plastic packages for integrated circuits over ceramic packages. Lighter and smaller; Ability to withstand physical shocks and G-forces; Cost-effectiveness; One-step manufacturing process; Complexity of ceramic package; Historical drawbacks to plastic.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics