Multichip module using multilayer YBa[sub 2]Cu[sub 3]O[sub 7-delta] interconnects

Burns, M.J.; Char, K.; Cole, B.F.; Ruby, W.S.; Sachtjen, S.A.
March 1993
Applied Physics Letters;3/22/1993, Vol. 62 Issue 12, p1435
Academic Journal
Reports the formation of multichip modules using high temperature superconductors for multilayer interconnection of bare semiconductor die. Interconnection of ten die with 160 pads at 3.4 centimeter squared substrate; Use of superconducting vias; Creation of two similar multilayer multichip module designs.


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