TITLE

Multichip module using multilayer YBa[sub 2]Cu[sub 3]O[sub 7-delta] interconnects

AUTHOR(S)
Burns, M.J.; Char, K.; Cole, B.F.; Ruby, W.S.; Sachtjen, S.A.
PUB. DATE
March 1993
SOURCE
Applied Physics Letters;3/22/1993, Vol. 62 Issue 12, p1435
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Reports the formation of multichip modules using high temperature superconductors for multilayer interconnection of bare semiconductor die. Interconnection of ten die with 160 pads at 3.4 centimeter squared substrate; Use of superconducting vias; Creation of two similar multilayer multichip module designs.
ACCESSION #
4337942

 

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