Electromigration failure due to interfacial diffusion in fine Al alloy lines

Hu, C.-K.; Small, M.B.; Rodbell, K.P.; Stanis, C.; Blauner, P.; Ho, P.S.
March 1993
Applied Physics Letters;3/1/1993, Vol. 62 Issue 9, p1023
Academic Journal
Examines the electromigration failure in fine aluminum alloy lines. Comparison between the interfacial mass transport along the edge of alloy lines and grain boundaries; Demonstration of the failure mechanism with bamboo grain structures.


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