TITLE

Effect of interface layer on the microstructure and electromigration resistance of AL-Si-Cu

AUTHOR(S)
Olowolafe, J.O.; Kawasaki, H.; Lee, C.C.; Klein, J.; Pintchovski, F.; Jawarani, D.
PUB. DATE
May 1993
SOURCE
Applied Physics Letters;5/10/1993, Vol. 62 Issue 19, p2443
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the effects of interface layer on the microstructure and electromigration resistance of aluminum-silicon-copper alloy. Sputter deposition of the alloy on ion-sputtered substrates; Analysis of TiN and Al microstructure; Link between electromigration median time to fail and Al intensities.
ACCESSION #
4329725

 

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