TiNCl formation during low-temperature, low-pressure chemical vapor deposition of TiN

Hegde, Rama I.; Fiordalice, Robert W.; Tobin, Philip J.
May 1993
Applied Physics Letters;5/10/1993, Vol. 62 Issue 19, p2326
Academic Journal
Describes the formation of titanium nitride chloride compound during low-temperature, low-pressure chemical vapor deposition of a titanium nitride film. Use of x-ray diffraction and Auger electron spectroscopy for film characterization; Properties of the deposited film; Link between film electrical resistivity and chlorine content.


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