Effect of Cu content on the reaction growth and morphology of an Al[sub 12]W compound between

Park, M.; Krause, S.J.; Wilson, S.R.
May 1993
Applied Physics Letters;5/3/1993, Vol. 62 Issue 18, p2203
Academic Journal
Examines the effect of copper content on the reaction growth and morphology of Al[sub 12]W compound between aluminum-copper/titanium-tungsten bilayers. Use of cross-section transmission electron microscopy; Suppression of spiked growth of the Al[sub 12]W phase; Alteration of the planar morphology.


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