TITLE

Electromigration wreaks havoc on IC design

AUTHOR(S)
Lloyd, Jim; Overhauser, David
PUB. DATE
March 1998
SOURCE
EDN;03/26/98, Vol. 43 Issue 7, p145
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents infomation on electromigration (EM), and how understanding this problem can prolong the life of an integrated circuit. How EM occurs; Why EM occurs; Problem associated with Joule heating; How EM can be prevented. INSET: The basics of electromigration.
ACCESSION #
432931

 

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