Suppression of microstructural coarsening and creep deformation in a lead-free solder

McCormack, M.; Jin, S.; Kammlott, G.W.
January 1994
Applied Physics Letters;1/31/1994, Vol. 64 Issue 5, p580
Academic Journal
Demonstrates the suppression of microstructural coarsening and creep deformation in lead-tin (Pb-Sn) solders. Production of uniform dispersion in the solder; Reduction of coarsening and creep rates due to dispersoid particles; Use of Pb-Sn solders to provide electrical and mechanical connections between components.


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