TITLE

Suppression of microstructural coarsening and creep deformation in a lead-free solder

AUTHOR(S)
McCormack, M.; Jin, S.; Kammlott, G.W.
PUB. DATE
January 1994
SOURCE
Applied Physics Letters;1/31/1994, Vol. 64 Issue 5, p580
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Demonstrates the suppression of microstructural coarsening and creep deformation in lead-tin (Pb-Sn) solders. Production of uniform dispersion in the solder; Reduction of coarsening and creep rates due to dispersoid particles; Use of Pb-Sn solders to provide electrical and mechanical connections between components.
ACCESSION #
4319542

 

Related Articles

  • Processing and Creep Properties of Sn-Cu Composite Solders with Small Amounts of Nanosized Ag Reinforcement Additions. Tai, F.; Guo, F.; Xia, Z. D.; Lei, Y. P.; Yan, Y. F.; Liu, J. P.; Shi, Y. W. // Journal of Electronic Materials;Nov2005, Vol. 34 Issue 11, p1357 

    In this research, nanosized Ag reinforcement particles were incorporated by mechanical means into a promising lead-free solder, Sn-0.7Cu, in an effort to improve the comprehensive property of the Sn-0.7Cu solder. Wettability, mechanical performance, and creep-rupture life tests were conducted to...

  • Microstructure evolution of Ti-6Al-4V laser weld joint HAZ in superplastic deformation process. Zhijiang Huang; Long Chen; Donghai Cheng; Yiping Chen; Dean Hu // Applied Mechanics & Materials;2014, Issue 511-512, p69 

    Microstructure of Ti-6AI-4V laser weld joint heat affected zone was observed. The results suggested that the heat affected zone microstructure first transformed to lamellar structure, then the grain growth and transformed to equiaxial grains. At the same temperature, the grain growth rate was...

  • Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys. N. Chawla; R. Sidhu // Journal of Materials Science: Materials in Electronics;Jan2007, Vol. 18 Issue 1-3, p175 

    Abstract??The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide...

  • Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. Fangjie Cheng; Nishikawa, Hiroshi; Takemoto, Tadashi // Journal of Materials Science;May2008, Vol. 43 Issue 10, p3643 

    The effects of minor additives, that is, Co and Ni, on the microstructural and mechanical properties of Sn–3.0 mass%Ag–0.5 mass%Cu (SAC305) bulk solder were investigated. The addition of Co and/or Ni resulted in microstructural changes of the SAC305 solder, such as the formation of...

  • New Pb-free solder alloy with superior mechanical properties. McCormack, M.; Jin, S. // Applied Physics Letters;7/5/1993, Vol. 63 Issue 1, p15 

    Develops a lead-free solder alloy based on the strontium-gold-zinc system. Comparison of the phase distributions of zinc and binary alloy; Effects of zinc on the mechanical strength of strontium; Impact of zinc on the solidification microstructure of the alloy.

  • Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications. Arfaei, Babak // JOM: The Journal of The Minerals, Metals & Materials Society (TM;Nov2014, Vol. 66 Issue 11, p2309 

    The article discusses papers presented at the Pb-Free Solders and Emerging Interconnect and Packaging Materials Symposium and published within the issue, including one by E. J. Cotts et al. on the effect of impurities on the solidification behavior and microstructure of lead-free solder bumps,...

  • Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy. Lee, Tae-Kyu; Zhou, Bite; Blair, Lauren; Liu, Kuo-Chuan; Bieler, Thomas // Journal of Electronic Materials;Dec2010, Vol. 39 Issue 12, p2588 

    Thermally cycled plastic ball grid array (PBGA) packages with full arrays of 196 solder joints after various preconditions were examined to observe the microstructure evolution of Sn-Ag-Cu solder joints during aging and thermal cycling, focusing on Sn grain orientation. Each PBGA package was...

  • Dynamic recrystallization in a near-eutectic Pb—Sn—Ag alloy under thermal cycling. Atroshenko, S. A.; Lyu, D. R.; Pao, I. Sh. // Technical Physics Letters;May98, Vol. 24 Issue 5, p341 

    An analysis is made of the behavior of solders under thermal cycling. Dynamic recrystallization can be used to explain the evolution of the microstructure of soldered joints during operation.

  • Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth. Chada, Srinivas // JOM: The Journal of The Minerals, Metals & Materials Society (TM;Oct2012, Vol. 64 Issue 10, p1174 

    An introduction to articles published within the issue is presented, including articles on Sn whisker growth and interfacial growth in lead-free solder, evolution of surface morphology and grain orientation in Sn surfaces to correlate whisker/hillock initiation with the underlying microstructure...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics