Reliability and microstructure of Al-Si-V-Pd alloy films for use in ultralarge scale integration

Dirks, A.G.; Augur, R.A.
February 1994
Applied Physics Letters;2/7/1994, Vol. 64 Issue 6, p704
Academic Journal
Evaluates the reliability of interconnect material based on aluminum. Superiority of AlSiVPd alloy films with AlSiV films; Distribution of (Al,V)-intermetallic particles for mechanical strength; Resistance of (Al,Pd) precipitates to annealing effects.


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