TITLE

iPhone 3G S maintains several Apple suppliers, adds new for $178.96 BOM, iSuppli reports

AUTHOR(S)
Deffree, Suzanne
PUB. DATE
June 2009
SOURCE
Electronic News (10616624);6/29/2009, Vol. 55 Issue 25, p4
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the teardown of a 16-gigabyte iPhone 3G S by market research company iSuppli Corp. It states that Broadcom Corp., Dialog Semiconductor PLC, and Toshiba are among the component suppliers identified in the teardown. According to the article, higher levels of wireless integration brought in new names for a total bill of materials (BOM) of $178.96 during the Teardown Analysis Service.
ACCESSION #
43180936

 

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