TITLE

Micromachined millimeter-wave photonic band-gap crystals

AUTHOR(S)
Ozbay, E.; Michel, E.
PUB. DATE
April 1994
SOURCE
Applied Physics Letters;4/18/1994, Vol. 64 Issue 16, p2059
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Presents a technique for fabricating three-dimensional photonic band-gap crystals. Utilization of micromachined silicon wafers to build the periodic dielectric structure; Information on photonic band-gap frequencies; Details on anisotropic etching of silicon by aqueous potassium hydroxide.
ACCESSION #
4272505

 

Related Articles

  • Design of Experiments for (100) Si Vertical Wall Wet Etching Using Sonicated NaOH Solution. Pakpum, Chupong; Pussadee, Nirut // Applied Mechanics & Materials;2015, Vol. 804, p12 

    Silicon-based thermoelectric device fabricated using standard semiconductor manufacturing technique is a promising technology that could lead to a mass production of clean energy. The vertical wall fabrication on Si substrates is typically achieved by high cost plasma etching and involved...

  • Marangoni wafer drying avoids disadvantages. Wolke, Klaus; Eitel, Barbel // Solid State Technology;Aug96, Vol. 39 Issue 8, p87 

    Explains the basic principle and process sequence for Marangoni drying, a method for drying semiconductor wafers. Particle performance; Residue-fee drying; Absence of wafer stress; Low alcohol consumption; Applications of the drying technique to 300-mm wafers.

  • Asyst, INFAB propose rival 300-mm handling ideas. P.N.D. // Solid State Technology;Jul95, Vol. 38 Issue 7, p48 

    Features approaches to the handling of 300-mm wafers. Design of a wafer cassette from Asyst; Handling system from INFAB.

  • Emerging technologies alter fab chemical consumption. Castellano, Robert N. // Solid State Technology;Jul95, Vol. 38 Issue 7, p54 

    Reports on how emerging technologies have altered the chemical consumption of the semiconductor wafer industry. Gases; Wet chemicals; Reprocessing of chemicals; Photoresist category.

  • 300-mm wafers: Hurry up and wait? Haavind, Robert // Solid State Technology;Feb96, Vol. 39 Issue 2, p14 

    Editorial. Focuses on the plan in the semiconductor industry to produce 300 millimeter wafers. Plans of Motorola's Semiconductor Division; Possible source of funding for the wafers; Delays in the implementation of the plans; Importance of the wafers to microprocessor producers.

  • 300 mm: A new frontier. Fosnight, William; Martin, Raymond // Solid State Technology;Feb96, Vol. 39 Issue 2, p77 

    Looks at some of the strategic issues affecting wafer handling for the 300-millimeter (mm) generation. Lessons from the transition to 200-mm; International cooperation on the design of 300-mm; Attention on the standards for cassette carriers; Interrelated choices faced by semiconductor factory...

  • 300 mm: Summit meeting, new products unveiled. P.D.; M.L. // Solid State Technology;Sep96, Vol. 39 Issue 9, p56 

    Reports on the development of 300 millimeter (mm) semiconductor wafers. Features of the Wafer Summit meeting between United States and Japanese officials; Features of the 300-mm unpatterned wafer inspection system; Varian's introduction of its 300-mm single-wafer high-current ion implanter.

  • Japan silicon companies embark on 400-mm project without Wacker or MEMC. P.D.; A.V. // Solid State Technology;Oct96, Vol. 39 Issue 10, pS1 

    Reports that seven Japanese producers of silicon wafers have established a program to develop 400-mm silicon wafer technology. Role of the Ministry of International Trade and Industry, German silicon supplier Wacker and MEMC Electronic Materials the project; Applicability to 300-mm products;...

  • Continuous flow manufacturing for adaptive fab management. K.D. // Solid State Technology;Dec97, Vol. 40 Issue 12, p30 

    Examines the use of continuous flow manufacturing (CFM) for effective management of semiconductor wafers. Advantages of CFM over full equipment utilization; Range management process used to balance cycle time and utilization around bottlenecks produced by full equipment utilization; Impact of...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics