Micromachined millimeter-wave photonic band-gap crystals

Ozbay, E.; Michel, E.
April 1994
Applied Physics Letters;4/18/1994, Vol. 64 Issue 16, p2059
Academic Journal
Presents a technique for fabricating three-dimensional photonic band-gap crystals. Utilization of micromachined silicon wafers to build the periodic dielectric structure; Information on photonic band-gap frequencies; Details on anisotropic etching of silicon by aqueous potassium hydroxide.


Related Articles

  • Design of Experiments for (100) Si Vertical Wall Wet Etching Using Sonicated NaOH Solution. Pakpum, Chupong; Pussadee, Nirut // Applied Mechanics & Materials;2015, Vol. 804, p12 

    Silicon-based thermoelectric device fabricated using standard semiconductor manufacturing technique is a promising technology that could lead to a mass production of clean energy. The vertical wall fabrication on Si substrates is typically achieved by high cost plasma etching and involved...

  • Marangoni wafer drying avoids disadvantages. Wolke, Klaus; Eitel, Barbel // Solid State Technology;Aug96, Vol. 39 Issue 8, p87 

    Explains the basic principle and process sequence for Marangoni drying, a method for drying semiconductor wafers. Particle performance; Residue-fee drying; Absence of wafer stress; Low alcohol consumption; Applications of the drying technique to 300-mm wafers.

  • Asyst, INFAB propose rival 300-mm handling ideas. P.N.D. // Solid State Technology;Jul95, Vol. 38 Issue 7, p48 

    Features approaches to the handling of 300-mm wafers. Design of a wafer cassette from Asyst; Handling system from INFAB.

  • Emerging technologies alter fab chemical consumption. Castellano, Robert N. // Solid State Technology;Jul95, Vol. 38 Issue 7, p54 

    Reports on how emerging technologies have altered the chemical consumption of the semiconductor wafer industry. Gases; Wet chemicals; Reprocessing of chemicals; Photoresist category.

  • 300-mm wafers: Hurry up and wait? Haavind, Robert // Solid State Technology;Feb96, Vol. 39 Issue 2, p14 

    Editorial. Focuses on the plan in the semiconductor industry to produce 300 millimeter wafers. Plans of Motorola's Semiconductor Division; Possible source of funding for the wafers; Delays in the implementation of the plans; Importance of the wafers to microprocessor producers.

  • 300 mm: A new frontier. Fosnight, William; Martin, Raymond // Solid State Technology;Feb96, Vol. 39 Issue 2, p77 

    Looks at some of the strategic issues affecting wafer handling for the 300-millimeter (mm) generation. Lessons from the transition to 200-mm; International cooperation on the design of 300-mm; Attention on the standards for cassette carriers; Interrelated choices faced by semiconductor factory...

  • 300 mm: Summit meeting, new products unveiled. P.D.; M.L. // Solid State Technology;Sep96, Vol. 39 Issue 9, p56 

    Reports on the development of 300 millimeter (mm) semiconductor wafers. Features of the Wafer Summit meeting between United States and Japanese officials; Features of the 300-mm unpatterned wafer inspection system; Varian's introduction of its 300-mm single-wafer high-current ion implanter.

  • Japan silicon companies embark on 400-mm project without Wacker or MEMC. P.D.; A.V. // Solid State Technology;Oct96, Vol. 39 Issue 10, pS1 

    Reports that seven Japanese producers of silicon wafers have established a program to develop 400-mm silicon wafer technology. Role of the Ministry of International Trade and Industry, German silicon supplier Wacker and MEMC Electronic Materials the project; Applicability to 300-mm products;...

  • Continuous flow manufacturing for adaptive fab management. K.D. // Solid State Technology;Dec97, Vol. 40 Issue 12, p30 

    Examines the use of continuous flow manufacturing (CFM) for effective management of semiconductor wafers. Advantages of CFM over full equipment utilization; Range management process used to balance cycle time and utilization around bottlenecks produced by full equipment utilization; Impact of...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics