Electromigration instability: Transgranular slits in interconnects

Suo, Z.; Wang, W.
April 1994
Applied Physics Letters;4/11/1994, Vol. 64 Issue 15, p1944
Academic Journal
Examines the electromigration instability of transgranular slits in interconnects. Description of a physical mechanism explaining the instability; Effect of electric current and surface energy atoms in atom diffusion on void surfaces; Influence of electric currents prevalence on slit emergence; Determination of width and velocity selection by the slits.


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