Experiments with back side gas cooling using an electrostatic wafer holder in an electron

Meyer, J.A.; Kirmse, K.H.R.
April 1994
Applied Physics Letters;4/11/1994, Vol. 64 Issue 15, p1926
Academic Journal
Presents experiments with back side gas cooling using an electrostatic wafer holder in an electron cyclotron resonance etching tool. Independence of the etch rate from the wafer temperature; Influence of helium on the etch uniformity; Balance of back side pressures between temperature control and helium leak rate.


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