TITLE

Direct bonding of organic materials

AUTHOR(S)
Spierings, G.A.C.M.; Haisma, J.
PUB. DATE
June 1994
SOURCE
Applied Physics Letters;6/13/1994, Vol. 64 Issue 24, p3246
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Demonstrates the direct bonding of organic materials using the polymer polymethylmethacrylate (PMMA) as a model system. Effect of heating a bonded PMMA/PMMA wafer pair on glass transition temperature; Implementation of PMMA wafer bonding to silicon and fused silica wafers; Presence of weak chemical interactions at bonded interface.
ACCESSION #
4266501

 

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