Effects of wafer bow and warpage on the integrity of thin gate oxides

Thakur, R.P.S.; Chhabra, N.
June 1994
Applied Physics Letters;6/20/1994, Vol. 64 Issue 25, p3428
Academic Journal
Examines the effects of initial wafer bow and warpage on the integrity of thinner gate oxides grown by furnace and rapid thermal processing methods. Correlation between wafer warpage and bow to the charge-to-breakdown characteristics of the gate oxide; Observation of an almost linear increase in defect density; Lifetime of the samples.


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