Very high-efficiency semiconductor wafer-bonded transparent-substrate

Kish, F.A.; Steranka, F.M.
May 1994
Applied Physics Letters;5/23/1994, Vol. 64 Issue 21, p2839
Academic Journal
Demonstrates the operation of transparent-substrate (Al[sub x]Ga[sub 1-x])[sub 0.5]In[sub 0.5]P/GaP light-emitting diodes (LED). Fabrication of the LED by semiconductor wafer bonding process; Details of the luminous and extraction efficiencies of LED; Stability of the wafer-bonded interface.


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