TITLE

Self-aligned passivation on copper interconnection durability against oxidizing ambient annealing

AUTHOR(S)
Itow, Hitoshi; Nakasaki, Yasushi
PUB. DATE
August 1993
SOURCE
Applied Physics Letters;8/16/1993, Vol. 63 Issue 7, p934
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Presents a self-aligned niobium (Nb) passivation method to improve the stability of copper (Cu) in an oxidizing ambient of thin films. Suppression of Cu diffusion into silica films and silicon substrates in the method; Formation of the Nb nitride layer on a Cu/Nb/silica/(100)silicon structure; Protection provided by the layer against oxidation.
ACCESSION #
4258243

 

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