Self-aligned passivation on copper interconnection durability against oxidizing ambient annealing

Itow, Hitoshi; Nakasaki, Yasushi
August 1993
Applied Physics Letters;8/16/1993, Vol. 63 Issue 7, p934
Academic Journal
Presents a self-aligned niobium (Nb) passivation method to improve the stability of copper (Cu) in an oxidizing ambient of thin films. Suppression of Cu diffusion into silica films and silicon substrates in the method; Formation of the Nb nitride layer on a Cu/Nb/silica/(100)silicon structure; Protection provided by the layer against oxidation.


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