TITLE

Lower-temperature plasma etching of Cu films using infrared radiation

AUTHOR(S)
Hosoi, N.; Ohshita, Y.
PUB. DATE
November 1993
SOURCE
Applied Physics Letters;11/8/1993, Vol. 63 Issue 19, p2703
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the lower-temperature plasma etching of copper films using infrared radiation (IR). Presentation of anisotropic fine copper patterns; Significance of IR radiation in the desorption process; Effect of IR light enhancement on etching temperature.
ACCESSION #
4250729

 

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