Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film

Sanchez Jr., John E.; Kraft, Oliver
December 1992
Applied Physics Letters;12/28/1992, Vol. 61 Issue 26, p3121
Academic Journal
Examines the electromigration-induced transgranular slit-like voids in aluminum and aluminum-copper thin-film interconnects. Determination of the grain structure from images; Role of mechanical stresses in the transgranular voiding mechanism; Significance of transgranular voiding as an electromigration failure mechanism.


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