Structure and thermal stability of Cu-In precipitates and their role in the semi-insulating

Leon, R.P.; Werner, P.
November 1992
Applied Physics Letters;11/23/1992, Vol. 61 Issue 21, p2545
Academic Journal
Examines the structure and thermal stability of copper (Cu) and indium (In) precipitates. Effect of high temperature annealing on the electrical behavior of indium phosphide and Cu; Evaporation of Cu following cleaning and etching processes; Efficiency of transmission electron microscopy in determining the crystallography of Cu and In particles.


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