Electromigraton activation energy dependence on AlCu interconnect linewidth and microstructure

Dreyer, M.L.; Varker, C.J.
April 1992
Applied Physics Letters;4/13/1992, Vol. 60 Issue 15, p1860
Academic Journal
Examines the dependence of electromigration activation energy on linewidth and grain size distribution in aluminum-copper interconnection. Interruption of electromigration within film grain structures; Influence of film microstructure on mass transport mechanism; Contribution of nongrain boundary diffusion mechanism to mass transport.


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