TITLE

Electromigraton activation energy dependence on AlCu interconnect linewidth and microstructure

AUTHOR(S)
Dreyer, M.L.; Varker, C.J.
PUB. DATE
April 1992
SOURCE
Applied Physics Letters;4/13/1992, Vol. 60 Issue 15, p1860
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the dependence of electromigration activation energy on linewidth and grain size distribution in aluminum-copper interconnection. Interruption of electromigration within film grain structures; Influence of film microstructure on mass transport mechanism; Contribution of nongrain boundary diffusion mechanism to mass transport.
ACCESSION #
4250496

 

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