TITLE

Diffusion in Ni/Cu bilayer films

AUTHOR(S)
Bai, P.; Gittleman, B.D.
PUB. DATE
April 1992
SOURCE
Applied Physics Letters;4/13/1992, Vol. 60 Issue 15, p1824
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the diffusion of copper (Cu) into the nickel (Ni) layer of a Ni/Cu bilayer film following thermal annealing application. Effect of increased deposition temperature of Ni layer on Cu diffusion; Connection between the physical structure and diffusion reduction of the Ni layer; Influence of diffusion on the resistivity of Cu layer.
ACCESSION #
4250484

 

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